Mid-state shorts are a major problem that often goes undetected by typical boundary scan connectivity tests is mid-state/resitive shorts. Flynn Systems recognized this “hole” in boundary scan testing and was the first boundary scan test company to test for mid-state shorts, improving test fault coverage.
Posts Tagged ‘Boundary Scan Testing’
The boundary scan test software provides a way to interconnect between integrated circuits (ICs) on a board without using physical test probes. The scan contains cells within a device that can capture data from pin or core logic signals or force data onto pins. The captured data is moved out and externally compared to other […]
Today’s consumer is provided a variety of options no matter what the subject matter happens to be. At Flynn Systems we like to keep things simple by providing the best solution in boundary scan options. Saving the consumer both time and money by avoiding trial and error software, Flynn’s boundary scan is no nonsense and […]
Chip manufacturers are now producing multichip modules (MCMs) that may include two or more arrays of devices within a single package. These modules can be tested using JTAG test pattern generation of the devices while on a PCB. To incorporate JTAG testing of MCMs there are several things that are needed: a netlist of the […]
One of the most common comments we hear from our customers and business partners sounds something like this: “Well, I’ve heard about boundary scan testing, and have actually used it a bit before. Moving forward, we have a new project we need to use it on, and we have a bone pile I might get to.”
Now that your board has moved from prototyping to manufacturing, things are humming along until…there is a snag in manufacturing. Suddenly an entire run of boards is failing for unknown reasons, and you’re already dangerously close to being behind schedule.
In our last discussion, we talked about DFT, which plays a significant role in reducing costs in prototyping. There are a wide variety of reasons that prototyping is a significant expense in the development and production processes. A large part of the cost is the increasing complexity of designs, inclusion of more processors and FPGA’s, greatly reduced board real estate, and diminishing test access. With the cost of FPGA’s and processors rising as they too become more powerful, getting small batches of devices is expensive. If one of those devices is fried during prototype testing, the cost to prototype a new design escalates rapidly, especially if the cause of the failure isn’t quickly determined.