Mid-state shorts are a major problem that often goes undetected by typical boundary scan connectivity tests is mid-state/resitive shorts. Flynn Systems recognized this “hole” in boundary scan testing and was the first boundary scan test company to test for mid-state shorts, improving test fault coverage.
onTAP JTAG Blog
If a chain of devices consisted only of boundary scan (JTAG) compliant devices, there would not be too much testing required. However, boards today contain complex, non-JTAG devices that interact with the boundary scan devices. Testing just the JTAG devices on the board is always an option. However, developing a test that takes into account […]
Once a board developer passes along the new board and all related files and procedures to a test developer, the boundary scan test process can begin. We recommend including the TAP Integrity Test at the beginning of your interconnect test because the TAP contains pins associated with the test access controller, e g., the TAP […]
Chip manufacturers are now producing multichip modules (MCMs) that may include two or more arrays of devices within a single package. These modules can be tested using JTAG test pattern generation of the devices while on a PCB. To incorporate JTAG testing of MCMs there are several things that are needed: a netlist of the […]
Not every boundary scan application experiences delays. Some run without any problems, but when there is a delay, oftentimes it can be traced back to lack of information from the board’s developer to the board’s tester.
Introduction As miniaturization of PCBs became more desirable, denser (or layered) printed circuit boards began to dominate the market. Testing electrical connectivity between devices posed a huge problem because board density and complex layering prevented the IC pins from being physically probed. The Joint Test Action Group (JTAG) developed a solution: boundary scan. The Joint Test […]
One of the most common comments we hear from our customers and business partners sounds something like this: “Well, I’ve heard about boundary scan testing, and have actually used it a bit before. Moving forward, we have a new project we need to use it on, and we have a bone pile I might get to.”
Now that your board has moved from prototyping to manufacturing, things are humming along until…there is a snag in manufacturing. Suddenly an entire run of boards is failing for unknown reasons, and you’re already dangerously close to being behind schedule.
In our last discussion, we talked about DFT, which plays a significant role in reducing costs in prototyping. There are a wide variety of reasons that prototyping is a significant expense in the development and production processes. A large part of the cost is the increasing complexity of designs, inclusion of more processors and FPGA’s, greatly reduced board real estate, and diminishing test access. With the cost of FPGA’s and processors rising as they too become more powerful, getting small batches of devices is expensive. If one of those devices is fried during prototype testing, the cost to prototype a new design escalates rapidly, especially if the cause of the failure isn’t quickly determined.