Introduction As miniaturization of PCBs became more desirable, denser (or layered) printed circuit boards began to dominate the market. Testing electrical connectivity between devices posed a huge problem because board density and complex layering prevented the IC pins from being physically probed. The Joint Test Action Group (JTAG) developed a solution: boundary scan. The Joint Test […]
onTAP JTAG Blog
One of the most common comments we hear from our customers and business partners sounds something like this: “Well, I’ve heard about boundary scan testing, and have actually used it a bit before. Moving forward, we have a new project we need to use it on, and we have a bone pile I might get to.”
Now that your board has moved from prototyping to manufacturing, things are humming along until…there is a snag in manufacturing. Suddenly an entire run of boards is failing for unknown reasons, and you’re already dangerously close to being behind schedule.
In our last discussion, we talked about DFT, which plays a significant role in reducing costs in prototyping. There are a wide variety of reasons that prototyping is a significant expense in the development and production processes. A large part of the cost is the increasing complexity of designs, inclusion of more processors and FPGA’s, greatly reduced board real estate, and diminishing test access. With the cost of FPGA’s and processors rising as they too become more powerful, getting small batches of devices is expensive. If one of those devices is fried during prototype testing, the cost to prototype a new design escalates rapidly, especially if the cause of the failure isn’t quickly determined.